Packaging & Testing
Testing and Packaging Online training gives you a deep understanding of how to package semiconductor devices, put them together, and test them for electrical and functional issues. It teaches students how to make sure that things are of good quality and work as they should.
Level
Advanced
Duration
8 weeks
Placement Client
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About Packaging & Testing
Rated #1 Recognized as the No.1 Institute for Packaging & Testing Online Training Course. This program focuses on the important steps that come after making the wafer, such as putting the device together, packaging it, and testing it thoroughly to make sure it works. Learners will look at different types of packaging, how to manage heat, how to test electrical systems, and how to find faults. The course also talks about more advanced packaging technologies like System-in-Package (SiP) and 3D IC. After this training, participants will have the skills they need to work in the back-end semiconductor manufacturing process.
Training Plan
About trainer
Working professional who is carrying more then 10 years of industry experience.
Decks & Updated Content
Access to updated presentation decks shared during live training sessions.
e-Book
E-book provided by TechPratham. All rights reserved.
Assignments & MCQs
Module-wise assignments and MCQs provided for practice.
Video Recording
Daily Session would be recorded and shared to the candidate.
Projects
Live projects will be provided for hands-on practice.
Resume Building
Expert-guided resume building with industry-focused content support.
Interview Preparation
Comprehensive interview preparation with real-time scenario practice.
Packaging & Testing
Course Curriculum
Introduction to IC Packaging & Testing
Overview of semiconductor packaging and testing in the manufacturing flow.
Wafer Testing (Probe Testing)
Electrical testing of wafers before packaging.
Packaging Technologies
Different packaging types used in semiconductor devices.
Assembly Process
Step-by-step IC assembly process after fabrication.
Thermal & Mechanical Considerations
Thermal management and mechanical reliability in packages.
Electrical Testing
Post-package electrical testing of ICs.
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Additional Program Highlights
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Who Should Take Packaging & Testing
IT Professionals
Non-IT Career Switchers
Fresh Graduates
Working Professionals
Ops/Administrators/HR
Developers
BA/QA Engineers
Cloud / Infra
IT Professionals
Non-IT Career Switchers
Fresh Graduates
Key Projects
<p>Packaging & Testing</p>
Packaging Flow Documentation
Document and simulate the complete IC packaging process, including material selection, assembly steps, and thermal considerations.
Reliability Stress Testing
Perform thermal cycle and stress simulation on a semiconductor package and analyze its impact on device performance.
Automated Test Setup Simulation
Design a virtual test bench using ATE concepts to validate IC functionality and generate fault analysis reports.
Placement Process
Live Class with Industry Use Cases
- Interactive learning
- Real-world examples
- Expert guidance
- Doubt resolution
Daily Assignment & Weekly Assessments
- Hands-on practice
- Concept reinforcement
- Weekly evaluation
- Timely feedback
Project Testing & Deployment
- Project development
- Testing practice
- Deployment exposure
- Portfolio creation
Interview Preparation (Mock, PD, Alumni Session)
- Mock interviews
- Personal development
- Alumni guidance
- Confidence building
Resume Building
- Resume crafting
- Industry-focused format
- Skills highlighting
- Professional presentation
Placement
- Job assistance
- Interview support
- Career guidance
- Opportunity access
Knowledge Center
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Course FAQs
Why is Packaging & Testing important in semiconductor manufacturing?
Industry-Recognized Certification
India
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Noida Office
C-2, Sector-1, Noida, Uttar Pradesh - 201301
India
Hyderabad Office
LVS Arcade, 6th Floor, Hitech City, Hyderabad