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CoursesVLSI Embedded Systems And Chip DesignPackaging & Testing
VLSI Embedded Systems And Chip Design
Packaging & Testing
Testing and Packaging Online training gives you a deep understanding of how to package semiconductor devices, put them together, and test them for electrical and functional issues. It teaches students how to make sure that things are of good quality and work as they should.
5/5(4,890 Reviews)

Level

Advanced

Duration

8 weeks

What is Packaging & Testing?
Rated #1 Recognized as the No.1 Institute for Packaging & Testing Online Training Course. This program focuses on the important steps that come after making the wafer, such as putting the device together, packaging it, and testing it thoroughly to make sure it works. Learners will look at different types of packaging, how to manage heat, how to test electrical systems, and how to find faults. The course also talks about more advanced packaging technologies like System-in-Package (SiP) and 3D IC. After this training, participants will have the skills they need to work in the back-end semiconductor manufacturing process.
Training Plan

About trainer

Working professional who is carrying more then 10 years of industry experience.

Decks

The candidate will get access to the presentation taken-up during the session.

Notes

Consolidated notes in word document.

Assignments

Assignments for every module will be covered.

MCQs

MCQs for every module covered in the session would be provided.

Video Recording

Daily Session would be recorded and shared to the candidate.

Dumps for Certification

We will provide dumps for the certification exam, which will help you to prepare for the exam.

Updated Content

We provide Generative AI Driven content By experts.

Projects

3 Live Projects will be provided for practice.

Packaging & Testing Course Curriculum
.

Introduction to Packaging
Section 1

Overview of semiconductor device packaging fundamentals.
Packaging Importance
Assembly Flow
Materials & Substrates
Thermal Management
Key Projects
Packaging & Testing
Packaging Flow Documentation
Document and simulate the complete IC packaging process, including material selection, assembly steps, and thermal considerations.
Reliability Stress Testing
Perform thermal cycle and stress simulation on a semiconductor package and analyze its impact on device performance.
Automated Test Setup Simulation
Design a virtual test bench using ATE concepts to validate IC functionality and generate fault analysis reports.

Packaging & Testing – Associate Training Program

Category
Associate
Exam Name:
Packaging & Testing – Associate
Exam Code:
N.A.
Exam Duration:
N.A.
Exam Format:
N.A.
Passing Score:
N.A.
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Frequently Asked Questions (FAQs)

Why is Packaging & Testing important in semiconductor manufacturing?

Before delivery, packaging and testing make sure that semiconductor devices are safe, reliable, and work as they should. Devices could fail in real-world situations if they don't have good packaging and thorough testing.

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