Rated #1 Recognized as the No.1 Institute for Packaging & Testing Online Training Course. This program focuses on the important steps that come after making the wafer, such as putting the device together, packaging it, and testing it thoroughly to make sure it works. Learners will look at different types of packaging, how to manage heat, how to test electrical systems, and how to find faults. The course also talks about more advanced packaging technologies like System-in-Package (SiP) and 3D IC. After this training, participants will have the skills they need to work in the back-end semiconductor manufacturing process.





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